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  november 2012 hvm-1057-e 1 < hvigbt modules > CM1200HC-90R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules CM1200HC-90R ? i c 1200a ? v ces 4500v ? 1-element in a pack ? insulated type ? lpt-igbt / soft recovery diode ? alsic baseplate application traction drives, high reliability c onverters / inverters, dc choppers outline drawing & circuit diagram dimensions in mm
< hvigbt modules > CM1200HC-90R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 hvm-1057-e 2 maximum ratings symbol item conditions ratings unit v ge = 0v, t j = ? 40?+125c 4500 v ces collector-emitter voltage v ge = 0v, t j = ? 50c 4400 v v ges gate-emitter voltage v ce = 0v, t j = 25c 20 v i c dc, t c = 85c 1200 a i crm collector current pulse (note 1) 2400 a i e dc 1200 a i erm emitter current (note 2) pulse (note 1) 2400 a p tot maximum power dissipation (note 3) t c = 25c, igbt part 12500 w v iso isolation voltage rms, sinusoidal, f = 60hz, t = 1 min. 6000 v v e partial discharge extinction voltage rms, sinusoidal, f = 60hz, q pd 10 pc 3500 v t j junction temperature ? 50 ~ +150 c t jop operating junction temperature ? 50 ~ +125 c t stg storage temperature ? 55 ~ +125 c t psc short circuit pulse width v cc = 3200v, v ce v ces , v ge =15v, t j =125c 10 ? s electrical characteristics limits symbol item conditions min typ max unit t j = 25c D D 16.0 i ces collector cutoff current v ce = v ces , v ge = 0v t j = 125c D 16.0 D ma v ge(th) gate-emitter threshold voltage v ce = 10 v, i c = 120 ma, t j = 25c 5.8 6.3 6.8 v i ges gate leakage current v ge = v ges , v ce = 0v, t j = 25c ? 0.5 D 0.5 a c ies input capacitance D 175.0 D nf c oes output capacitance D 11.0 D nf c res reverse transfer capacitance v ce = 10 v, v ge = 0 v, f = 100 khz t j = 25c D 5.0 D nf q g total gate charge v cc = 2800v, i c = 1200a, v ge = 15v D 13.5 D c t j = 25c D 3.50 D v cesat collector-emitter saturation voltage i c = 1200 a (note 4) v ge = 15 v t j = 125c D 4.40 5.10 v t j = 25c D 1.00 D t d(on) turn-on delay time t j = 125c D 0.95 1.50 s t j = 25c D 0.28 D t r turn-on rise time t j = 125c D 0.30 0.50 s t j = 25c D 4.30 D e on(10%) turn-on switching energy (note 5) t j = 125c D 5.10 D j t j = 25c D 4.60 D e on turn-on switching energy (note 6) v cc = 2800 v i c = 1200 a v ge = 15 v r g(on) = 2.7 ? l s = 150 nh inductive load t j = 125c D 5.50 D j/p t j = 25c D 3.60 D t d(off) turn-off delay time t j = 125c D 3.80 5.00 s t j = 25c D 0.35 D t f turn-off fall time t j = 125c D 0.45 1.00 s t j = 25c D 2.90 D e off(10%) turn-off switching energy (note 5) t j = 125c D 3.85 D j t j = 25c D 3.20 D e off turn-off switching energy (note 6) v cc = 2800 v i c = 1200 a v ge = 15 v r g(off) = 10 ? l s = 150 nh inductive load t j = 125c D 4.30 D j
< hvigbt modules > CM1200HC-90R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 hvm-1057-e 3 electrical characteristics (continuation) limits symbol item conditions min typ max unit t j = 25c ? 2.50 ? v ec emitter-collector voltage (note 2) i e = 1200 a (note 4) v ge = 0 v t j = 125c ? 2.80 3.40 v t j = 25c ? 0.70 ? t rr reverse recovery time (note 2) t j = 125c ? 0.90 ? s t j = 25c ? 1100 ? i rr reverse recovery current (note 2) t j = 125c ? 1200 ? a t j = 25c ? 1000 ? q rr reverse recovery charge (note 2) t j = 125c ? 1500 ? c t j = 25c ? 1.30 ? e rec(10%) reverse recovery energy (note 2) (note 5) t j = 125c ? 2.10 ? j t j = 25c ? 1.55 ? e rec reverse recovery energy (note 2) (note 6) v cc = 2800 v i c = 1200 a v ge = 15 v r g(on) = 2.7 ? l s = 150 nh inductive load t j = 125c ? 2.40 ? j thermal characteristics limits symbol item conditions min typ max unit r th(j-c)q junction to case, igbt part D D 10.0 k/kw r th(j-c)d thermal resistance junction to case, fwdi part D D 19.0 k/kw r th(c-s) contact thermal resistance case to heat sink, ? grease = 1w/m k, d (c-s) = 100 ? m D 6.0 D k/kw mechanical characteristics limits symbol item conditions min typ max unit m t m8 : main terminals screw 7.0 D 22.0 nm m s m6 : mounting screw 3.0 D 6.0 nm m t mounting torque m4 : auxiliary terminals screw 1.0 D 3.0 nm m mass D 1.2 D kg cti comparative tracking index 600 D D D d a clearance 19.5 D D mm d s creepage distance 32.0 D D mm l p ce parasitic stray inductance D 11.0 D nh r cc?+ee? internal lead resistance t c = 25c D 0.12 D m ? r g internal gate resistance t c = 25c D 1.7 D ? ? note1. pulse width and repetition rate should be such that junction temperature (t j ) does not exceed t opmax rating. 2. the symbols represent characteristics of the anti-parallel, emitter to collector free-wheel diode (fwd i ). 3. junction temperature (t j ) should not exceed t jmax rating (150c). 4. pulse width and repetition rate should be such as to cause negligible temperature rise. 5. e on(10%) / e off(10%) / e rec(10%) are the integral of 0.1v ce x 0.1i c x dt. 6. definition of all items is according to iec 60747, unless otherwise specified.
< hvigbt modules > CM1200HC-90R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 hvm-1057-e 4 performance curves output characteristics (typical) 0 500 1000 1500 2000 2500 02468 collector - emitter voltage [v] coll ector current [a] v ge = 10v v ge = 11v v ge = 15v v ge = 13v tj = 25c v ge = 16v collector-emitter saturation voltag e characteristics (typical) 0 500 10 00 15 00 20 00 25 00 02468 collector-emitter saturation voltage [v] coll ector current [a] v ge = 15 v tj = 1 25 c tj = 25c transfer characteristics (typical) 0 50 0 1000 1500 2000 2500 04 81216 gate - emitter voltage [v] coll ector current [a] tj = 25c v ce = v ge tj = 1 25 c free-wheel diode forward characteristics (typical) 0 500 10 00 15 00 20 00 25 00 012345 emitter-coll ector voltage [v] emi tter current [a] tj = 25c tj = 125c
< hvigbt modules > CM1200HC-90R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 hvm-1057-e 5 performance curves capacitance characteristics (typical) 1 10 100 10 00 0.1 1 10 100 collector-emitter voltage [v] capa citance [nf] cies v ge = 0v, tj = 25c f = 10 0khz co es cre s half-bridge switching energy characteristics (typical) 0 2 4 6 8 10 12 14 16 0 5 00 1 000 1 50 0 200 0 25 00 collec tor curre nt [a] switching energies [j/pulse] erec v cc = 280 0v, v ge = 1 5v r g( on) = 2. 7 ? , r g(off ) = 10 ? l s = 15 0nh , t j = 125 c i ndu cti ve lo ad eoff eon gate charge characteristics (typical) -1 5 -1 0 -5 0 5 10 15 20 0 5 10 15 20 gate charge [ c] gate-emitter voltage [v] v ce = 28 00v, i c = 1 200 a tj = 2 5 c half-bridge switching energy characteristics (typical) 0 2 4 6 8 10 12 012345 gate resistor [ohm] switching energies [j/pulse] ere c v cc = 28 00v, i c = 1 200 a v ge = 1 5v, l s = 1 50n h t j = 1 25 c, i nd uct ive l oad eon
< hvigbt modules > CM1200HC-90R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 hvm-1057-e 6 performance curves half-bridge switching energy characteristics (typical) 0 2 4 6 8 10 12 05101520 gate resistor [ohm] switching energies [j/pulse] v cc = 28 00 v, i c = 1 200 a v ge = 15v, l s = 1 50n h tj = 1 25 c, i n duct ive l oa d eoff free-wheel diode reverse recovery characteristics (typical) 0.1 1 10 10 0 100 1000 10000 emitter current [a] reverse recovery time [s] 10 100 1 000 1 000 0 reverse recovery current [a] trr irr v cc = 28 00 v, v ge = 15v r g(on) = 2.7 ? , l s = 150 nh tj = 1 25 c, in ductive l oa d half-bridge switching time characteristics (typical) 0.0 1 0.1 1 10 10 0 10 0 10 00 1 00 00 coll ector current [a] switching times [s] v cc = 2 800 v, v ge = 15v r g(on ) = 2. 7 ? , r g( off) = 10 ? l s = 150nh, tj = 125c in ducti ve loa d tr td(on) td(off) tf reverse bias safe operating area (rbsoa) 0 500 10 00 15 00 20 00 25 00 30 00 0 10002000300040005000 collector-emitter voltage [v] coll ector current [a] v cc ? 32 00 v, v ge = 15v tj = 125 c, r g(o ff) = 10 ?
< hvigbt modules > CM1200HC-90R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 hvm-1057-e 7 performance curves short circuit safe operating area (scsoa) 0 2 4 6 8 10 12 0 10 00 2 000 3 00 0 400 0 50 00 collector-emitter vol tage [v] coll ector current [ka] v cc ? 32 00v, v ge = 1 5v tj = 125c, r g(on) = 2.7 ? , r g( off) = 1 0 ? transient thermal impedance characteristics 0 0.2 0.4 0.6 0.8 1 1.2 0. 001 0.0 1 0.1 1 1 0 ti me [s ] normalized transient thermal impedance rt h(j-c)q = 10 .0 k/kw rth(j-c)r = 1 9.0k/kw free-wheel diode reverse recovery safe operating area (rrsoa) 0 500 10 00 15 00 20 00 25 00 30 00 0 10002000300040005000 emitte r-collector voltage [v] reverse recovery current [a] v cc ? 32 00 v, di /d t < 6 ka/ s tj = 125 c ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? exp1 rz i t n 1i i )cj(th )t( ? 1234 r i [k/kw] : 0.0096 0.1893 0.4044 0.3967 t i [sec] : 0.0001 0.0058 0.0602 0.3512
< hvigbt modules > CM1200HC-90R high power switching use insulated type 4th-version hvigbt (high voltage insulated gate bipolar transistor) modules december 2012 hvm-1057-e 8 ? 2012 mitsubishi electric corporation. all rights reserved. keep safety first in your circuit designs! mitsubishi electric corporation puts the maximum effo rt into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. trouble with semiconductors may lead to personal injury, fire or property damage. remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non?flammable material or (iii) prevention against any malfunction or mishap. notes regarding these materials ?these materials are intended as a reference to assist our customers in the selection of the mitsubishi semiconductor product best suited to the customer?s application; they do not convey any license under any intellectual property rights, or any other rights, belonging to mitsubishi electric corporation or a third party. ?mitsubishi electric corporation assumes no respons ibility for any damage, or infringement of any third?party?s rights, originating in the use of any pr oduct data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. ?all information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the ti me of publication of these materials, and are subject to change by mitsubishi electric corporation without not ice due to product improvements or other reasons. it is therefore recommended that customers contact mitsubishi electric corporation or an authorized mitsubishi semiconductor product dist ributor for the latest product information before purchasing a product listed herein. the information described here may contain technical inaccuracies or typographical errors. mitsubishi electric corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. please also pay attention to information published by mitsubishi electric corporation by various means, including the mitsubishi semiconductor home page (http://www. mitsubishielectric.com/). ?when using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to eval uate all information as a total system before making a final decision on the applicability of the informatio n and products. mitsubishi electric corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. ?mitsubishi electric corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. please contact mitsubishi electric corporation or an authorized mitsubishi semiconductor product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aer ospace, nuclear, or undersea repeater use. ?the prior written approval of mitsubishi electric corpor ation is necessary to reprin t or reproduce in whole or in part these materials. ?if these products or technologies are subject to the japanese export control restrictions, they must be exported under a license from the japanese government and cannot be imported into a country other t han the approved destination. any diversion or re export contrary to the export control laws and regulations of japan and/or the country of destination is prohibited. ?please contact mitsubishi electric corporation or an authorized mitsubishi semiconductor product distributor for further details on these materials or the products contained therein.


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